The arena of console modding leads us to a few extraordinarily spectacular tasks, and a contemporary one we featured of be aware used to be a conveyable NES produced via [Redherring32]. It used to be particular since the authentic NES customized DIP chips were sanded right down to one thing like a surface-mount QFN bundle. Again when our colleague [Arya] wrote up the undertaking there wasn’t a lot data, however since then the entire main points had been publish in a GitHub repository. Possibly of maximum passion, it comprises a complete instructional for the chip-sanding procedure.
To take irreplaceable vintage chips and sand them down should take some guts, however the premise is a valid sufficient one. Within a DIP bundle is a chip provider and a internet of touch strips that pass to the pins, this procedure merely sands away the epoxy to reveal the ones strips for brand new contacts. The end result can then be reflowed as would occur with any QFN, and utilized in a brand new, smaller NES.
Alongside the best way this gives an enchanting perception into DIP development that the majority folks by no means see. If any of you will have ever controlled to fatigue a pin off a DIP, you’ll additionally unquestionably be considering how the method may well be used to reattach a conductor.
You’ll learn our authentic protection of the undertaking right here.